JPH0735403Y2 - リードフレーム - Google Patents
リードフレームInfo
- Publication number
- JPH0735403Y2 JPH0735403Y2 JP1987137391U JP13739187U JPH0735403Y2 JP H0735403 Y2 JPH0735403 Y2 JP H0735403Y2 JP 1987137391 U JP1987137391 U JP 1987137391U JP 13739187 U JP13739187 U JP 13739187U JP H0735403 Y2 JPH0735403 Y2 JP H0735403Y2
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- die pad
- chip
- pad portion
- piece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000011347 resin Substances 0.000 claims description 29
- 229920005989 resin Polymers 0.000 claims description 29
- 229910045601 alloy Inorganic materials 0.000 claims description 19
- 239000000956 alloy Substances 0.000 claims description 19
- 238000002788 crimping Methods 0.000 claims description 10
- 230000008878 coupling Effects 0.000 claims description 6
- 238000010168 coupling process Methods 0.000 claims description 6
- 238000005859 coupling reaction Methods 0.000 claims description 6
- 238000005304 joining Methods 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 238000007789 sealing Methods 0.000 claims description 4
- 238000000465 moulding Methods 0.000 description 27
- 238000005336 cracking Methods 0.000 description 12
- 229910003271 Ni-Fe Inorganic materials 0.000 description 7
- 230000000694 effects Effects 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 229910000640 Fe alloy Inorganic materials 0.000 description 4
- 238000003466 welding Methods 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 229910017813 Cu—Cr Inorganic materials 0.000 description 1
- 229910017709 Ni Co Inorganic materials 0.000 description 1
- 229910003267 Ni-Co Inorganic materials 0.000 description 1
- 229910003262 Ni‐Co Inorganic materials 0.000 description 1
- 229910001297 Zn alloy Inorganic materials 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8338—Bonding interfaces outside the semiconductor or solid-state body
- H01L2224/83385—Shape, e.g. interlocking features
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987137391U JPH0735403Y2 (ja) | 1987-09-08 | 1987-09-08 | リードフレーム |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987137391U JPH0735403Y2 (ja) | 1987-09-08 | 1987-09-08 | リードフレーム |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6441146U JPS6441146U (en]) | 1989-03-13 |
| JPH0735403Y2 true JPH0735403Y2 (ja) | 1995-08-09 |
Family
ID=31398773
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987137391U Expired - Lifetime JPH0735403Y2 (ja) | 1987-09-08 | 1987-09-08 | リードフレーム |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0735403Y2 (en]) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5703008B2 (ja) * | 2010-12-16 | 2015-04-15 | 新電元工業株式会社 | フレーム組立体、半導体装置及びその製造方法 |
| JP2020094933A (ja) * | 2018-12-13 | 2020-06-18 | 日立オートモティブシステムズ株式会社 | 熱式流量計 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5662345A (en) * | 1979-10-26 | 1981-05-28 | Hitachi Ltd | Load frame and semiconductor device |
| JPS6284541A (ja) * | 1985-10-08 | 1987-04-18 | Sumitomo Electric Ind Ltd | 半導体装置用リ−ドフレ−ム |
| JPS62136059A (ja) * | 1985-12-09 | 1987-06-19 | Mitsubishi Electric Corp | 樹脂封止半導体装置用リ−ドフレ−ム |
-
1987
- 1987-09-08 JP JP1987137391U patent/JPH0735403Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6441146U (en]) | 1989-03-13 |
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